Inhibiting effects of imidazole on copper corrosion in 1 M HNO3 solution
- 15 May 2003
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 348 (1-2) , 217-226
- https://doi.org/10.1016/s0921-5093(02)00734-7
Abstract
No abstract availableKeywords
This publication has 24 references indexed in Scilit:
- Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallizationApplied Physics Letters, 2001
- Interactions between solder and metallization during long-term aging of advanced microelectronic packagesJournal of Electronic Materials, 2001
- Characterization of Sputtered Tantalum Carbide Barrier Layer for Copper MetallizationJournal of the Electrochemical Society, 2000
- Bis-triazole as a new corrosion inhibitor for copper in sulfate solution. A model for synergistic inhibition actionJournal of Materials Science, 2000
- Cleaning of copper foil coated with sodium hexanoate as corrosion inhibitorJournal of Applied Electrochemistry, 2000
- The inhibition of copper corrosion in 0.1 M NaCl under heat exchange conditionsCorrosion Science, 1996
- Correlation of Surface Wettability and Corrosion Rate for Benzotriazole‐Treated CopperJournal of the Electrochemical Society, 1992
- Evaluation of AHT as Corrosion Inhibitor for α-Brass in Acid Chloride SolutionsCorrosion, 1991
- Electrochemical behavior of copper in deaerated 1.0 M HCl solutions in the absence and presence of Fe(III) and benzotriazole (BTAH)Journal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1990
- Adsorbed corrosion inhibitors studied by electron spectroscopy: Benzotriazole on copper and copper alloysCorrosion Science, 1978