Interactions between solder and metallization during long-term aging of advanced microelectronic packages
- 1 April 2001
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 30 (4) , 379-385
- https://doi.org/10.1007/s11664-001-0047-6
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finishJournal of Electronic Materials, 2000
- Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after agingMetallurgical and Materials Transactions A, 2000
- Reaction kinetics of solder-balls with pads in BGA packages during reflow solderingJournal of Electronic Materials, 1999