Enhancement of the wettability and solder joint reliability at the Sn–9Zn–0.5Ag lead-free solder alloy–Cu interface by Ag precoating
- 6 October 2003
- journal article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 360 (1-2) , 217-224
- https://doi.org/10.1016/s0925-8388(03)00300-1
Abstract
No abstract availableThis publication has 18 references indexed in Scilit:
- Effect of aging on the growth of intermetallic compounds at the interface of Sn–9Zn–xAg/Cu substratesJournal of Crystal Growth, 2003
- Morphological stability of solder reaction products in flip chip technologyJournal of Electronic Materials, 2001
- Flux development for lead-free solders containing zincJournal of Electronic Materials, 2000
- Lead-free Solders in MicroelectronicsMaterials Science and Engineering: R: Reports, 2000
- The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic soldersJournal of Electronic Materials, 1999
- The role of intermetallic compounds in lead‐free solderingSoldering & Surface Mount Technology, 1998
- Mode I fracture toughness testing of eutectic Sn-Pb solder jointsJournal of Electronic Materials, 1994
- Progress in the design of new lead-free solder alloysJOM, 1993
- Slovenian- and Polish-American "Polka" MusicJournal of American Folklore, 1989
- Barrier Layers Against DiffusionTransactions of the IMF, 1979