The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders
- 1 November 1999
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1256-1262
- https://doi.org/10.1007/s11664-999-0165-0
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Manufacturing Challenges in Electronic PackagingPublished by Springer Nature ,1998
- Dynamic Aspects of Wetting Balance TestsJournal of Electronic Packaging, 1996
- Simulation and Interpretation of Wetting Balance Tests Using the Surface EvolverJournal of Electronic Packaging, 1996
- Evaluation of Lead- Free Solder Joints in Electronic AssembliesJournal of Electronic Materials, 1994
- Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A reviewJournal of Electronic Materials, 1994
- Quantitative Solderability Measurement of Electronic ComponentsSoldering & Surface Mount Technology, 1991
- Quantitative Solderability Measurement of Electronic ComponentsSoldering & Surface Mount Technology, 1990
- Quantitative Solderability Measurement of Electronic ComponentsSoldering & Surface Mount Technology, 1990