Buried Schottky Contacts in Patterned Cobalt Silicide Layers in Silicon Using Wafer Bonding
- 1 January 1994
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Platinum silicide fusion bondingElectronics Letters, 1991
- Metal‐to‐Metal Bonding Using an Oxidizing Ambient AtmosphereJournal of the Electrochemical Society, 1988
- Extraction of Schottky diode parameters from forward current-voltage characteristicsApplied Physics Letters, 1986
- Wafer bonding for silicon-on-insulator technologiesApplied Physics Letters, 1986