RESIDUAL ELECTRICALLY ACTIVE DEFECTS AFTER LATTICE REORDERING IN ION-IMPLANTED SILICON
- 15 June 1971
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 18 (12) , 548-550
- https://doi.org/10.1063/1.1653534
Abstract
Thermally stimulated current measurements have been conducted on low‐dose carbon‐implanted silicon. After annealing for lattice reordering, five defect levels are found still present and of energies ranging from 0.27 to 0.40 eV. Since they all show similar annealing to above 500°C, they reveal a major annealing stage in low‐dose ion‐implanted silicon that occurs at considerably higher temperatures than what is generally ascribed to lattice reordering.Keywords
This publication has 6 references indexed in Scilit:
- MINORITY CARRIER LIFETIME IN ION-IMPLANTED AND ANNEALED SILICONApplied Physics Letters, 1970
- Determination of deep centers in silicon by thermally stimulated conductivity measurementsSolid-State Electronics, 1969
- DIRECT EVIDENCE OF DIVACANCY FORMATION IN SILICON BY ION IMPLANTATIONApplied Physics Letters, 1969
- A Technique for Trap Determinations in Low-Resistivity SemiconductorsJournal of Applied Physics, 1968
- Ion implantation of silicon and germanium at room temperature. Analysis by means of 1.0-MeV helium ion scatteringCanadian Journal of Physics, 1968
- ION IMPLANTATION OF SILICON: I. ATOM LOCATION AND LATTICE DISORDER BY MEANS OF 1.0-MeV HELIUM ION SCATTERINGCanadian Journal of Physics, 1967