Measurement and field simulation based characterization of plastic IC packages
- 23 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- A circuit topology for microwave modeling of plastic surface mount packagesIEEE Transactions on Microwave Theory and Techniques, 1996
- An experimental technique for full package inductance matrix characterizationIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- Measurement of package inductance and capacitance matricesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996