An experimental technique for full package inductance matrix characterization
- 1 May 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 19 (2) , 338-343
- https://doi.org/10.1109/96.496037
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Considerations on package design for high speed and high pin count CMOS devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- High-frequency inductance measurements and characterization of alloy 42 and copper packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Lead inductance of ferromagnetic materials and a method to reduce inductance at low frequenciesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Measurement of package inductance and capacitance matricesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- Package inductance characterization at high frequenciesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994
- Characterization and modeling of multiple line interconnections from time domain measurementsIEEE Transactions on Microwave Theory and Techniques, 1994
- Measuring Package and Interconnect Model Parameters Using Distributed ImpedancePublished by Institute of Electrical and Electronics Engineers (IEEE) ,1992
- Accurate experimental characterization of interconnects: a discussion of 'Experimental electrical characterization of interconnects and discontinuities in high-speed digital systems'IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992