Measurement of package inductance and capacitance matrices
- 1 February 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 19 (1) , 225-229
- https://doi.org/10.1109/96.486506
Abstract
A technique is presented for the measurement of resistance, inductance, conductance, and capacitance matrices of large pin count electronic packages. Circuit analysis of an assumed lumped model is used to define a measurement technique based on two sets of measurements on specially prepared samples. Formulas are derived for use with network analyzer measurements. Measurements and simulations on a 208-lead quad flat pack show that the method attains good accuracy for all but the small values of the conductance matrix.Keywords
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