Characterization of TiN barriers against Cu diffusion by capacitance–voltage measurement
- 1 July 1998
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 16 (4) , 2019-2025
- https://doi.org/10.1116/1.590123
Abstract
No abstract availableThis publication has 15 references indexed in Scilit:
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