3D microwave modules for space applications
- 27 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 3, 1289-1292
- https://doi.org/10.1109/mwsym.1998.700610
Abstract
This paper describes the design, manufacturing and measurement of 3D microwave modules. The vertical interconnection between stacked circuits is based on an shielded homogeneous coplanar line with a 90/spl deg/ vertical structure. The fabrication of these modules is in relation with the "MultiChip Module Vertical" technology, originally developed for digital applications. The electrical measurement in the Ku-band demonstrates very good results. Author(s) Monfraix, P. Alcatel Espace, Toulouse, France Ulian, P. ; Drevon, C. ; George, S. ; Vera, A.C. ; Tronche, C. ; Cazaux, J.L. ; Llopis, O. ; Graffeuil, J.Keywords
This publication has 3 references indexed in Scilit:
- 3D interconnection for ultra-dense multichip modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- New 3D low loss, wide band microwave interconnectionPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- High density microwave packaging programPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002