A new index S for evaluating solder joint thermal fatigue strength
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4) , 1146-1153
- https://doi.org/10.1109/33.62565
Abstract
No abstract availableKeywords
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