Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys
Top Cited Papers
- 1 March 2003
- journal article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 352 (1-2) , 237-245
- https://doi.org/10.1016/s0925-8388(02)01168-4
Abstract
No abstract availableFunding Information
- Ministry of Education, Culture, Sports, Science and Technology
This publication has 14 references indexed in Scilit:
- Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal agingMaterials Chemistry and Physics, 2001
- Advances in lead-free electronics solderingPublished by Elsevier ,2001
- Thermodynamic calculation of the In–Sn–Zn ternary systemJournal of Alloys and Compounds, 2001
- Effect of Ag Content on Properties of Sn-Ag Binary Alloy SolderMATERIALS TRANSACTIONS, 2001
- Microstructural Features of Lift-Off Phenomenon in Through-Hole Circuit Soldered by Sn-Bi AlloyScripta Materialia, 1998
- Thermodynamics-aided alloy design and evaluation of Pb-free solder, SnBiInZn systemActa Materialia, 1997
- A thermodynamic study of the phase equilibria in the Bi-Sn-Sb systemJournal of Electronic Materials, 1994
- Improved mechanical properties in new, Pb-free solder alloysJournal of Electronic Materials, 1994
- In search of new lead-free electronic soldersJournal of Electronic Materials, 1994
- New lead-free, Sn-Zn-In solder alloysJournal of Electronic Materials, 1994