Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging
- 1 September 2001
- journal article
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 71 (3) , 255-271
- https://doi.org/10.1016/s0254-0584(01)00298-x
Abstract
No abstract availableThis publication has 28 references indexed in Scilit:
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