Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper
- 1 October 1995
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 24 (10) , 1493-1505
- https://doi.org/10.1007/bf02655468
Abstract
No abstract availableKeywords
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- A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated with Tin and its AlloysTransactions of the IMF, 1973