Optoelectronic integrated AlGaAs/GaAs p-i-n/field-effect transistor with an embedded, planar p-i-n photodiode

Abstract
A new planarization technique for fabricating an optoelectronic integrated circuit (OEIC) has been developed. A photodiode has been perfectly embedded in a semi‐insulating GaAs substrate with a high uniformity over the wafer. A monolithically integrated pin photodiode/field‐effect transistor (FET) has been successfully fabricated by applying this technique. This result indicates that the present technique is promising for the application to fabricating not only pin/FET but also larger scale OEIC receivers and transmitters.