Released Si microstructures fabricated by deep etching and shallow diffusion
- 1 March 1996
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 5 (1) , 18-23
- https://doi.org/10.1109/84.485211
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
- Micromechanical structures for thin film characterizationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- An RIE process for submicron, silicon electromechanical structuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- High-aspect-ratio Si etching for microsensor fabricationJournal of Vacuum Science & Technology A, 1995
- High aspect ratio polyimide etching using an oxygen plasma generated by electron cyclotron resonance sourceJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1994
- A study of residual stress distribution through the thickness of p/sup +/ silicon films (thermal oxidation effects)IEEE Transactions on Electron Devices, 1993
- Etching of Si with Cl2 using an electron cyclotron resonance sourceJournal of Vacuum Science & Technology A, 1993
- Metallic microstructures fabricated using photosensitive polyimide electroplating moldsJournal of Microelectromechanical Systems, 1993
- Electrostatic Comb Drive Levitation And Control MethodJournal of Microelectromechanical Systems, 1992
- Design, fabrication, and operation of submicron gap comb-drive microactuatorsJournal of Microelectromechanical Systems, 1992
- Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)Microelectronic Engineering, 1986