The honeycomb-shape capacitor structure for ULSI DRAM
- 1 August 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. 14 (8) , 369-371
- https://doi.org/10.1109/55.225582
Abstract
A way to increase the charge stored in polysilicon capacitors using surface modulation technology is proposed. Asperities on the polysilicon surface are achieved by reactive ion etching (RIE) of the polysilicon, using the oxide at the grain boundary as a mask. The fabricated polysilicon electrode has a honeycomb shape. With this structure, the capacitance is increased by four times for a polysilicon storage electrode of 250-nm thickness. The leakage current is comparable to that of convection stacked capacitors (STCs).Keywords
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