Dry etch challenges of 0.25 μm dual damascene structures
- 30 November 1997
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 37-38, 59-65
- https://doi.org/10.1016/s0167-9317(97)00094-4
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Fine‐Line Patterning of Parylene‐n by Reactive Ion Etching for Application as an Interlayer DielectricJournal of the Electrochemical Society, 1996
- Contact Failures due to Polymer Films Formed during Via-Hole EtchingJapanese Journal of Applied Physics, 1990