The Black Silicon Method V: A Study Of The Fabricating Of Movable Structures For Micro Electromechanical Systems
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 565-568
- https://doi.org/10.1109/sensor.1995.717287
Abstract
This paper presents a study of various well-known release techniques (bulk- and surface-micromachining) for the fabrication of movable silicon micromechanical structures. Their pro's and con's will be discussed. Further, a detailed study of a new self-aligned plasma technique is presented which uses silicon on insulator wafers (SOI). It has the ability to etch, release, and passivate MEMS in one RIE run. Therefore, MEMS can be fabricated quickly, accurate, and at low costs.Keywords
This publication has 6 references indexed in Scilit:
- The black silicon method II:The effect of mask material and loading on the reactive ion etching of deep silicon trenchesMicroelectronic Engineering, 1995
- Electrostatically driven vacuum-encapsulated polysilicon resonators Part I. Design and fabricationSensors and Actuators A: Physical, 1994
- Stiction of surface micromachined structures after rinsing and drying: model and investigation of adhesion mechanismsSensors and Actuators A: Physical, 1994
- Applications of fluorocarbon polymers in micromechanics and micromachiningSensors and Actuators A: Physical, 1994
- SCREAM I: A single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structuresSensors and Actuators A: Physical, 1994
- Etching of Thermal Oxides in Low Pressure Anhydrous HF / CH 3 OH Gas Mixture at Elevated TemperatureJournal of the Electrochemical Society, 1993