Implementation of timestep changes in transmission‐line matrix diffusion modelling

This publication has 9 references indexed in Scilit:

• Use of the three-dimensional TLM method in the thermal simulation and design of semiconductor devices
  IEEE Transactions on Electron Devices, 1992
• An error parameter in TLM diffusion modelling
  International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 1992
• A Thermal Model for Cyclic Glass Pressing Processes Using Transmission Line Modelling
  Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 1991
• Automatic timestepping in TLM routines for the modelling of thermal diffusion processes
  International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 1990
• TLM modelling of the thermal behaviour of conducting films on insulating substrates
  Journal of Physics D: Applied Physics, 1987
• Modelling of thermal diffusion in three dimensions by the transmission line matrix method and the incorporation of nonlinear thermal properties
  Communications in Applied Numerical Methods, 1987
• Application of transmission‐line modelling (TLM) to thermal diffusion in bodies of complex geometry
  International Journal for Numerical Methods in Engineering, 1986
• A two-dimensional transmission line matrix model for heat flow in power semiconductors
  Journal of Physics D: Applied Physics, 1985
• The calculation of temperature distribution in punch-through structures during pulsed operation using the transmission line modelling (TLM) method
  Journal of Physics D: Applied Physics, 1982