Use of the three-dimensional TLM method in the thermal simulation and design of semiconductor devices
- 1 June 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 39 (6) , 1295-1302
- https://doi.org/10.1109/16.137307
Abstract
No abstract availableKeywords
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