Dielectric properties of electron-beam deposited Ga2O3 films

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Abstract
We have fabricated high quality, dielectric Ga2O3 thin films. The films with thicknesses between 40 and 4000 Å were deposited by electron‐beam evaporation using a single‐crystal high purity Gd3Ga5O12 source. Metal‐insulator‐semiconductor (MIS) and metal‐insulator‐metal structures (MIM) were fabricated in order to determine dielectric properties, which were found to depend strongly on deposition conditions such as substrate temperature and oxygen pressure. We obtained excellent dielectric properties for films deposited at substrate temperatures of 40 °C with no excess oxygen and at 125 °C with an oxygen partial pressure of 2×10−4 Torr. Specific resistivities ρ and dc breakdown fields Em of up to 6×1013 Ω cm and 2.1 MV/cm, respectively, were measured. Static dielectric constants between 9.93 and 10.2 were determined for these films. Like in other dielectrics, the current transport mechanisms are found to be bulk rather than electrode controlled.