Electromigration damage in aluminum-copper films
- 1 May 1976
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 34 (1) , 165-169
- https://doi.org/10.1016/0040-6090(76)90159-0
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Grain-boundary solute electromigration in polycrystalline filmsJournal of Applied Physics, 1974
- Electromigration-induced failures in thin-film Al-Cu conductorsJournal of Electronic Materials, 1974
- Effect of Microstructure on the Electromigration Life of Thin-Film A1–Cu ConductorsJournal of Applied Physics, 1972
- STUDY OF FAILURE MECHANISMS IN Al–Cu THIN FILMS BY HIGH-VOLTAGE ELECTRON MICROSCOPYApplied Physics Letters, 1971
- The effect of copper additions on electromigration in aluminum thin filmsMetallurgical Transactions, 1971
- Reduction of Electromigration in Aluminum Films by Copper DopingIBM Journal of Research and Development, 1970