Three-dimensional masterslice MMIC on Si substrate
- 1 January 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 45 (12) , 2524-2530
- https://doi.org/10.1109/22.643869
Abstract
No abstract availableThis publication has 15 references indexed in Scilit:
- Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMICPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 5.8 GHz and 12.6 GHz Si bipolar MMICsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Monolithic planar RF inductor and waveguide structures on silicon with performance comparable to those in GaAs MMICPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- L-band internally matched Si-MMIC front-endIEEE Transactions on Microwave Theory and Techniques, 1996
- Highly integrated three-dimensional MMIC single-chip receiver and transmitterIEEE Transactions on Microwave Theory and Techniques, 1996
- Three-dimensional passive circuit technology for ultra-compact MMICsIEEE Transactions on Microwave Theory and Techniques, 1995
- Coplanar waveguides and microwave inductors on silicon substratesIEEE Transactions on Microwave Theory and Techniques, 1995
- 0.5-/spl mu/m bipolar technology using a new base formation method: SST1CPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1993
- Characterization of MIS structure coplanar transmission lines for investigation of signal propagation in integrated circuitsIEEE Transactions on Microwave Theory and Techniques, 1990
- Analysis of the waveguide with loss or gain by the finite‐element methodElectronics and Communications in Japan (Part II: Electronics), 1989