Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag
- 1 February 2002
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 31 (2) , 142-151
- https://doi.org/10.1007/s11664-002-0161-0
Abstract
No abstract availableKeywords
This publication has 21 references indexed in Scilit:
- Low cycle fatigue test for solders using non-contact digital image measurement systemInternational Journal of Fatigue, 2002
- Lead-free Solders in MicroelectronicsMaterials Science and Engineering: R: Reports, 2000
- Deformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin AlloyJournal of Electronic Packaging, 1999
- Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloysJournal of Electronic Materials, 1998
- Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloyJournal of Electronic Materials, 1998
- A STUDY OF FATIGUE AND CREEP BEHAVIOUR OF FOUR HIGH TEMPERATURE SOLDERSFatigue & Fracture of Engineering Materials & Structures, 1996
- Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb SolderJournal of Electronic Packaging, 1991
- High and Low Temperature Strain-Life Behavior of a Pb Rich SolderJournal of Electronic Packaging, 1990
- Isothermal Fatigue of 63Sn-37Pb SolderJournal of Electronic Packaging, 1990
- Cyclic deformation and fracture in Pb-Sn solid solution alloyMetallurgical Transactions A, 1988