Influence of temperature, humidity and defect location on delamination in plastic IC packages
- 27 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- An Interfacial Delamination Analysis for Multichip Module Thin Film InterconnectsJournal of Electronic Packaging, 1996
- Bimaterial interfacial crack growth as a function of mode-mixityIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
- Predicting delamination in plastic IC packages and determining suitable mold compound propertiesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994
- Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination Within Package.TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 1994
- A New Method for Measuring Adhesion Strength of IC Molding CompoundsJournal of Electronic Packaging, 1992
- Cracks on bimaterial interfaces: elasticity and plasticity aspectsMaterials Science and Engineering: A, 1991
- Mixed Mode Cracking in Layered MaterialsPublished by Elsevier ,1991
- Experimental determination of interfacial toughness curves using Brazil-nut-sandwichesActa Metallurgica et Materialia, 1990
- Interfacial Cracks in Ceramic‐to‐Metal Bonds under Transient Thermal LoadsJournal of the American Ceramic Society, 1987
- The Penny-Shaped Interface Crack With Heat Flow, Part 2: Imperfect ContactJournal of Applied Mechanics, 1983