Towards a VLSI packaging design support environment (PDSE); concepts and implementation
- 4 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 443-448
- https://doi.org/10.1109/iccd.1990.130274
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Simulation of transients in VLSI packaging interconnectionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Computer aided design system for VLSI interconnectionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Electrical Modeling of Interconnections in Multilayer Packaging StructuresIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987