Elevated temperature aging of solder joints based on Sn-Ag-Cu: Effects on joint microstructure and shear strength
- 1 December 2004
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 33 (12) , 1485-1496
- https://doi.org/10.1007/s11664-004-0090-1
Abstract
No abstract availableKeywords
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