Simulation and design of lossy transmission lines in a thin-film multichip package
- 1 June 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (2) , 294-302
- https://doi.org/10.1109/33.56160
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Ultra-reliable packaging for silicon-on-silicon WSIPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Multilayer thin-film substrate for multichip packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Thin-film pulse propagation analysis using frequency techniquesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- A self-terminating low-voltage swing CMOS output driverIEEE Journal of Solid-State Circuits, 1988
- Multichip Packaging Design for VLSI-Based SystemsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Laser-patterned interconnect for thin-film hybrid wafer-scale circuitsIEEE Electron Device Letters, 1987
- A high-performance thermal module for computer packagingJournal of Electronic Materials, 1987
- Time-domain response of multiconductor transmission linesProceedings of the IEEE, 1987
- Silicon hybrid wafer-scale package technologyIEEE Journal of Solid-State Circuits, 1986
- Silicon-On-Silicon PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984