Adhesion, internal stress, microstructure and resistivity of thin alloy films of aluminium, copper and silver
- 15 October 1982
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 96 (3) , 257-263
- https://doi.org/10.1016/0040-6090(82)90250-4
Abstract
No abstract availableKeywords
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