IN-SITU Analysis Of The Microstructure of Thermally Treated Thin Copper Films
- 1 January 1993
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
Copper thin films were deposited by sputtering, electron beam evaporation, and electroless plating onto nitride membranes for TEM analysis. The samples were heat treated in-situ from room temperature to 600 °C for structural and chemical analysis. The as-deposited and heat treated microstructures were investigated. Orientation changes with heat treatment and reactions among the sample layers were analyzed by electron diffraction. This work provides baseline information for a study of the thermal evolution of copper lines.Keywords
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