Simulation by ballistic deposition of local density variation and step coverage for via metallization
- 1 May 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. 10 (5) , 198-199
- https://doi.org/10.1109/55.31719
Abstract
The simulation is presented of ballistic deposition of sputtered metal deposited over a via. The step coverage of the film is determined and surface profiles provided at different film thicknesses. The use of a ballistic deposition technique provides additional information unattainable through the use of conventional film deposition simulations. A density profile of the film is produced and the columnar microstructure analyzed.Keywords
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