Improving electromigration reliability in Al-alloy lines
- 1 December 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 270 (1-2) , 439-444
- https://doi.org/10.1016/0040-6090(96)80074-5
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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