The mechanism of electromigration failure of narrow Al-2Cu-1Si thin-film interconnects
- 15 May 1993
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 73 (10) , 4885-4893
- https://doi.org/10.1063/1.353806
Abstract
No abstract availableThis publication has 27 references indexed in Scilit:
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