On void nucleation and growth in metal interconnect lines under electromigration conditions
- 1 July 1992
- journal article
- research article
- Published by Springer Nature in Metallurgical Transactions A
- Vol. 23 (7) , 2007-2013
- https://doi.org/10.1007/bf02647548
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Stress generation by electromigrationApplied Physics Letters, 1976
- Electromigration in thin aluminum films on titanium nitrideJournal of Applied Physics, 1976
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969