Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils
- 15 December 1999
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 86 (12) , 6746-6751
- https://doi.org/10.1063/1.371751
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
- Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripeningPhysical Review B, 1996
- Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafersApplied Physics Letters, 1996
- First order distributed feedback operation in ZnSe based laser structuresApplied Physics Letters, 1995
- Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on CuJournal of Materials Research, 1995
- Effect of Sn content of Pb-Sn solder alloys on wetting dynamicsScripta Metallurgica et Materialia, 1994
- The formation and growth of intermetallics in composite solderJournal of Electronic Materials, 1993
- Characterization of eutectic Sn-Bi solder jointsJournal of Electronic Materials, 1992
- Thermodynamics of Wetting by Liquid MetalsMRS Proceedings, 1987
- Dissolution kinetics of nickel in liquid tinMetallurgical Transactions B, 1981
- Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interfaceScripta Metallurgica, 1980