Electrotransport in copper alloy films and the defect mechanism in grain boundary diffusion
- 1 February 1975
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 25 (2) , 531-544
- https://doi.org/10.1016/0040-6090(75)90071-1
Abstract
No abstract availableThis publication has 23 references indexed in Scilit:
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