Thermoelastic analysis of periodic thin lines deposited on a substrate
- 1 April 1999
- journal article
- Published by Elsevier in Journal of the Mechanics and Physics of Solids
- Vol. 47 (5) , 1113-1130
- https://doi.org/10.1016/s0022-5096(98)00092-1
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- Evolution of stresses in passivated and unpassivated metal interconnectsJournal of Materials Research, 1998
- Thermoelastic properties in combined bending and extension of thin composite laminates with transverse matrix cracksInternational Journal of Solids and Structures, 1997
- Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu linesJournal of Materials Research, 1996
- An analytic model for thermoelastic properties of composite laminates containing transverse matrix cracksInternational Journal of Solids and Structures, 1993
- Stress analysis of encapsulated fine-line aluminum interconnectApplied Physics Letters, 1987
- Comments on Aleck’s Stress Distribution in Clamped PlatesJournal of Applied Mechanics, 1981
- Stress distributions in silicon crystal substrates with thin filmsJournal of Applied Physics, 1981
- Film-edge-induced stress in substratesJournal of Applied Physics, 1979
- Enhanced X-Ray Diffraction from Substrate Crystals Containing Discontinuous Surface FilmsJournal of Applied Physics, 1967
- Thermal Stresses in a Rectangular Plate Clamped Along an EdgeJournal of Applied Mechanics, 1949