Characterization and analysis on the solder ball shear testing conditions
- 13 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1065-1071
- https://doi.org/10.1109/ectc.2001.927949
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Missing solder ball failure mechanisms in plastic ball grid array packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The influence of room temperature aging on ball shear strength and microstructure of area array solder ballsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnectPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Behaviour of platinum as UBM in flip chip solder jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002