New approaches to failure analysis using XPS sputter‐depth profiles

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Abstract
The methodology of failure analysis and the use of XPS sputter‐depth profiles in failure analysis is illustrated in three examples: a titanium adhesive bond, a multilayer optical filter, and an ohmic contact. XPS sputter‐depth profiles supplement those obtained using AES and are essential to the failure analysis of a non‐conducting sample or one that is easily damaged by an electron beam. XPS sputter‐depth profiles also allow chemical state determination and improved quantification, especially for samples in which the Auger signals of different elements overlap.