Abstract
The microfabrication techniques used to develop high-performance closed-loop-controlled microelectromechanical systems (MEMS) are discussed. A generalized MEMS could consist of mechanical components, sensors, actuators, and electronics, all integrated in the same environment. Bulk and surface micromachining, substrate bonding, and electroforming in conjunction with X-ray lithography, all integral components of silicon micromachining, are described. The development of a materials base for MEMS and a variety of physical phenomena for microactuator applications that have recently been demonstrated are reviewed. The applications and future trends of MEMS technologies are discussed.

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