Failure analysis of power modules: a look at the packaging and reliability of large IGBTs
- 1 June 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (4) , 412-417
- https://doi.org/10.1109/33.237930
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Solder Fatigue Problems in Power PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power TransistorsIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- Reliability of silicon power transistorsMicroelectronics Reliability, 1976