Direct bonding: retrospect and outlook
- 31 December 1995
- journal article
- Published by Elsevier in Philips Journal of Research
- Vol. 49 (1-2) , 171-177
- https://doi.org/10.1016/0165-5817(95)82010-8
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Plasma thinning of silicon-on-insulator bonded wafersMicroelectronic Engineering, 1993
- Single-crysytal silicon pressure sensors with 500 × overpressure protectionSensors and Actuators A: Physical, 1990