Flip-chip bonding optimizes opto-ICs
- 1 November 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Circuits and Devices Magazine
- Vol. 8 (6) , 25-31
- https://doi.org/10.1109/101.167509
Abstract
The development of fabrication techniques for optical components and hybrid assemblies based on flip-chip bonding is outlined. It is argued that the solder-bump technique offers self-alignment, ruggedness, and potentially low manufacturing cost to integrated optics, semiconductor lasers, and optical interconnect devices. Examples of applying flip-chip solder bonding to these devices are presented.Keywords
This publication has 12 references indexed in Scilit:
- 8 channel InGaAs/InP quantum well asymmetric Fabry-Perot modulator hybridised with foundry VLSI silicon CMOS drive circuitsElectronics Letters, 1992
- Uniform 8×8 array InGaAs/InP multiquantum well asymmetric Fabry–Perot modulators for flipchip solder bond hybrid optical interconnectElectronics Letters, 1992
- Optoelectronic component arrays for optical interconnection of circuits and subsystemsJournal of Lightwave Technology, 1991
- Optical receiver array in silicon bipolar technology with selfaligned, low parasitic III/V detectors for DC-1 Gbit/s parallel linksElectronics Letters, 1991
- Balanced polarisation diversity receiver using hybrid assembly techniques for optical coherent multichannel systemsElectronics Letters, 1991
- 8×8 flipchip assembled InGaAs detector arrays for optical interconnectElectronics Letters, 1991
- Flip-chip solder bond mounting of laser diodesElectronics Letters, 1991
- Flip chip-bonded GaAs MMICs compatible with foundry manufactureIEE Proceedings H Microwaves, Antennas and Propagation, 1991
- 8×8 element hybridised PLZT/silicon spatial light modulator arrayElectronics Letters, 1989
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969