The EMI benefits of ground plane stitching in multi-layer power bus stacks
- 7 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- EMI associated with inter-board connection for module-on-backplane and stacked-card configurationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- An investigation of PCB radiated emissions from simultaneous switching noisePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Impact on radiated emissions of printed circuit board stitchingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Characterization of plated via hole fences for isolation between stripline circuits in LTCC packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cablesIEEE Transactions on Electromagnetic Compatibility, 1996
- FD-TD analysis of electromagnetic radiation from modules-on-backplane configurationsIEEE Transactions on Electromagnetic Compatibility, 1995
- FD-TD modeling of digital signal propagation in 3-D circuits with passive and active loadsIEEE Transactions on Microwave Theory and Techniques, 1994