The Role of Grain Boundaries in the Electrical Resistance of Submicron Grained Nickel
- 16 January 1992
- journal article
- research article
- Published by Wiley in Physica Status Solidi (a)
- Vol. 129 (1) , 231-236
- https://doi.org/10.1002/pssa.2211290122
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Grain boundary influence on the electrical resistance of submicron grained copperPhysica Status Solidi (a), 1990
- Temperature-dependent resistivity measurements on polycrystalline SiO2-covered thin nickel filmsThin Solid Films, 1987
- Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External SurfacesPhysical Review B, 1970