Multichip packaging technology with laser-patterned interconnects
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 646-649
- https://doi.org/10.1109/33.49028
Abstract
No abstract availableKeywords
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