Design and modeling of compact on-chip transformer/balun using multi-level metal windings for RF integrated circuits

13 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 117-120
https://doi.org/10.1109/rfic.2001.935655

Abstract

A compact integrated balun transformer is analyzed that meets the size demand of highly integrated RFICs for the wireless industry. The design of a balun transformer with 4:1 impedance ratio using multi-level windings significantly reduces the silicon area compared to that occupied by an equivalent planar design. Its application is demonstrated in a highly efficient, linear amplifier design which achieved first pass design success.

Keywords

This publication has 3 references indexed in Scilit:

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Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
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