The tradeoff between peripheral and area array bonding of components in multichip modules
- 1 June 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 17 (2) , 249-256
- https://doi.org/10.1109/95.296406
Abstract
No abstract availableKeywords
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